Required Rules and Hardware Spec for Internal FSAE Projects
Table of Contents
1 Packages
- All components must have a minimum pitch of
0.65 mm. - No ball grid array (BGA) packages.
2 Operating Conditions
- Generally speaking, all hardware should be able to tolerate an operating
temperatures of
-40°C ~ 60°C, the most ideal would be-40°C ~ 85°C. - Consider other forms of interference as well (EMI, vibrations, noise, etc).